Silicon Wafer Sorter
Convenient MES docking system, open TCP/IP protocol and database.
Main advantages
Fast sorting speed:
Stable mass production up to 15000 PCs/h.
Bernoulli suspended blanking mode is adopted.
High detection accuracy:
Size detection accuracy ≤20μ(3σ)
Accuracy of 3D thickness detection is ≤0.5μ(3σ).
Resistivity detection accuracy ≤2%(3σ)
The detection rate of dirt/crack/hole/edge collapse is ≥98%
Strong compatibility:
Compatible single crystal/polycrystalline detection
Support 166-230mm silicon wafer full/half, feeding compatible with 100/120pcs basket model.
The thickness is 100-240 μm and the resistivity is 0.2-20Ω.
Each module of the detection station can be selected according to the customer's needs, and can be continuously expanded.
The standard of blanking station is 3 stations, and the number of stations can be reduced or increased.
Self-developed software and algorithm platform:
Convenient for customers to customize requirements: automatic sheet cutting, spot check and alarm, etc.
Convenient MES docking system, open TCP/IP protocol and database.