Semi-Conductive Chip AOI
Suitable for chip appearance defect detection
Describe
Advantage
High efficiency: can support the cosmetic inspection of 6 surfaces of the chip, UPH: 3000
High integration: modular design, which can support flexible adjustment of multiple vacuum nozzle arms; the design space utilization rate of the machine is high, and 6 motion axes are integrated to achieve multi-angle detection
Support output of real-time inspection report and yield statistics, support MES system
Parameter
|
Size |
L1800mm*W1400mm*H2000mm |
|
Load/Unload type |
Auto Load/Unload with tray stack |
|
UPH |
3000 |
|
Integration |
Integrated Automation/Machine vision |
|
Accuracy |
≤0.01mm2 |
|
Overkill rate |
<5% |
|
Escape rate |
<1% |
|
Compatibility |
Compatible with 2mm*2mm~10mm*10mm chip cosmetic inspection |
